E-mobility

Identify edge bead inline to reduce waste by monitoring the edge shape with laser profilers. The LJ-X8000 can produce a stable profile (even on wet, black surfaces) to provide real-time coating process feedback.

Detect chipping or dents in laser welded beads using 3D laser profilers. The measurement is unaffected by color or gloss of the weld, making inspection results stable through glare or bead shape variation.

Measure expansion during charge/discharge testing to understand shape changes during abnormalities that could impact battery safety.

Detect burrs arising on terminals after electrode slitting. With ultra-high-resolution 3200 points/profile measurement, the LJ-X8000 Series produces stable detection even for minute burrs.

Inspect for lamination misalignment after winding. With a minimum X-resolution of 2.5 μm, the LJ-X8000 Series accurately measures the profile of each electrode.

Provide feedback about disconnected locations in electrodes before lamination. Accurately acquire the profile of electrode terminals to perform high-accuracy inspection of edge locations.

After assembling the flat wire, inspect whether the insulating paper is in the correct position. The LJ-X8000 series can measure with high accuracy even when various materials such as metal, rectangular wire, and paper are mixed.

Inspect motor height after powder welding using the LJ-X8000 Series. The 3D laser profiler provides reliable 100% inspection with its high speed and measurement stability.

Confirming seal shape helps to prevent oil leakage during the lifespan of the motor. The LJ-X8000 Series can inspect the shape using height data, resulting in more reliable inspection than a general image sensor could provide.

Detect fine chips that can occur when inserting magnets into rotors using 3D inspection. The LJ-X8000 Series provides high resolution 3D images, making it possible to reliably inspect for tiny chips that are difficult to detect from a 2D image.

Proper installation of the O-ring is critical for preventing oil leakage that could damage the ECU. Using the LJ-X8000 Series, you can check for accurate assembly and record measured values inline.

Inspect for substrate warpage without stopping the line using a 2D laser profiler. The LJ-X Series can check for gaps between the carrier and the substrate without having to stop and scan the part with a 1D sensor, which reduces inspection time.

Reliably inspect connector height and detect bent pins inline. Laser profilers capture a high resolution 3D image of the connector shape, providing an accurate, non-contact method for sorting at high speed.

Check for volume and even distribution of solder paste on PCB inline. Multiple areas can be inspected simultaneously from the 3D image.

Measure the position and projection of connector terminals simultaneously. Conventionally, two measurement steps were required using an image processing system and a contact sensor. The LJ-X8000 Series can perform both inspections simultaneously. This achieves cost reduction by reducing the amount of installed equipment.

Measure the flatness of the terminals of power modules. The target is detected by its surface and the flatness is measured based on the reference plane calculated with the least squares fitting method. The errors caused by the tilted positions of targets can be cancelled, which ensures accurate inspection.

Conventionally, a vision sensor was used for OK/NG judgement based on the area. Since the LJ-X8000 Series can measure the volume and position of paste application, it can reduce material costs and support higher component densities.